Thin-film electronics can be 'fabbed', say researchers
April 29, 2024
New research by KU Leuven and imec concludes that the foundry production model can be applied to the field of flexible thin-film electronics.
IBM plans $730m expansion of Canadian chip operation
April 29, 2024
IBM is preparing to invest heavily in its 800-acre semiconductor packaging and testing plant in Bromont, Quebec.
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TSMC: A16 manufacturing will start in 2026
April 26, 2024
The race is on to manufacture the worlds fastest chips, and TSMC has just made a bold claim to be winning it.
TTM opens its first manufacturing facility in Penang
April 25, 2024
PCB manufacturer TTM Technologies has officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD 200 million (approximately MYR 958 million).
TTM Technologies invests in Inovaxe’s SREX Racks
April 25, 2024
During the recent 2024 IPC APEX Expo TTM Technologies chose to invest SREX Racks from Inovaxe, directly off the show.
Thomas Gottwald takes on the role of CTO at Schweizer
April 24, 2024
The Supervisory Board of Schweizer Electronic AG has appointed Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of years with effect from 1 May 2024.
ZF opens automotive technology center in Mexico.
April 23, 2024
Mobility technology company ZF has officially opened the campus that will house four corporate function hubs for North America and the company's first R&D center in Monterrey, Mexico.
UCT opens new manufacturing facility in Malaysia
April 23, 2024
Ultra Clean Holdings, Inc. (UCT), has officially inaugurated its new manufacturing facility in Pulau Pinang. The new facility represents an investment of MYR 250 million (about EUR 49 million).
Silicon Creations hits milestone of 10 million wafers in production with TSMC
April 23, 2024
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
Toshiba to axe 5,000 jobs as re-structure continues
April 22, 2024
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Hitachi and Sagar Semi agree MoU on high-power devices
April 19, 2024
Hitachi's Power Semiconductor Device (HPSD) division has agreed a deal to help India's Sagar Semiconductors to build a new facility to produce high-voltage semiconductors for the automotive industry.
Axcelis ships multiple systems to SiC chipmakers
April 18, 2024
Axcelis Technologies announces multiple shipments of the Purion Power Series ion implanter systems to silicon carbide (SiC) power device chipmakers worldwide.
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PCBs: price reduction of up to -50.3% through AI
Thanks to the increased use of AI in production preparation, Multi-CB, a leading European PCB specialist, has been able to permanently reduce the prices for 1- and 2-layer PCBs. The price for a half Eurocard (80x100mm), for example, is now € 14.80 instead of € 29.80. Due to the process, the price reduction has the most significant effect on small quantities, although medium quantities are also benefiting.
Samsung to receive $6.4B Chips Act boost for Texas fab
April 17, 2024
The Biden administration will award Samsung Electronics with up to USD 6.4 billion in direct funding to expand the company's semiconductor production in Texas as part of the CHIPS and Science Act.
Mitsubishi to expand Texas plant for semiconductor chemicals
April 17, 2024
Mitsubishi Gas Chemical Company has decided to expand the Texas Plant of MGC Pure Chemicals America (MPCA), a subsidiary that manufactures super-pure hydrogen peroxide and super-pure ammonium hydroxide for use during the manufacturing process of semiconductors.
R2 Semiconductor files lawsuit against Intel in France
April 17, 2024
R2 Semiconductor has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc.
Bransys expands PCB assembly capabilities
April 17, 2024
Bransys Group, offering PCB design and assembly services, has recently acquired a Jade MKII Selective Soldering System from Pillarhouse.
Kyocera AVX breaks ground on new facility
April 16, 2024
Kyocera AVX new 49,000-square-foot manufacturing and design center will allow the company to produce millions of precision timing and frequency control products.
Applied Materials could abandon $4bn US R&D project
April 15, 2024
Sources say Applied Materials might cancel its proposed Silicon Valley research unit because of a lack of government investment.
Microchip acquires VSI
April 11, 2024
Microchip Technology has completed the acquisition of Seoul, Korea-based VSI Co. Ltd., a specialist in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for In-Vehicle Networking (IVN).
Arena team up with AMD
April 11, 2024
AMD and Arena are looking to scale the deployment of the first AI test solution to enhance next-generation GPU performance optimisations.
CSA Catapult opens new advanced packaging facility
April 11, 2024
A new GBP 1.6 million facility to help accelerate electrification across the UK has officially opened at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales.
Taiwan DRAM manufacturers gradually resume production
April 10, 2024
DRAM manufacturers are gradually resuming production following the earthquake that struck Taiwan on April 3, 2024. Despite some damages and the necessity for inspections or disposal of wafers among suppliers, TredForce reports that the impact on the total DRAM output for Q2 is estimated to be less than 1%
Infineon and Amkor looks to strengthen European supply chain
April 10, 2024
Infineon Technologies says that it is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology.
China to become the largest source of IC wafer capacity by 2026
April 10, 2024
According to the Global Wafer Capacity 2024 report from Knometa Research, wafer capacity for IC production is projected to grow on average 7.1% each year through 2026.
Polymatech and Orbray sign MoU on sapphire ingots
April 09, 2024
Chennai-headquartered Polymatech Electronics has agreed a deal with Japanese precision manufacturing firm Orbray to work together on sapphire wafer fabrication.
TSMC increases its investment in US production to $65bn
April 08, 2024
Taiwan's contract chipmaker TSMC will build a new fab in Arizona in what is claimed to be the largest direct project investment by a foreign company ever.
US government promises $75m for critical minerals research
April 08, 2024
The US Department of Energy’s (DOE) Office of Fossil Energy and Carbon Management has announced a support package to boost the domestic critical minerals sector.
AI chip specialist Hailo raises $120m
April 08, 2024
Israel-based chipmaker Hailo has completed a new fund raise to bring its lifetime total to $340m since 2017.
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